| SnAgCu焊点电迁移诱发IMC阴极异常堆积 |
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| 引用本文： | 常红,李明雨.SnAgCu焊点电迁移诱发IMC阴极异常堆积[J].电子元件与材料,2011,30(4):50-52,58. |
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| 作者姓名： | 常红 李明雨 |
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| 作者单位： | 哈尔滨工业大学深圳研究生院现代焊接生产技术国家重点实验室; |
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| 基金项目： | 广东省科技计划资助项目(No.2008A080403008—04) |
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| 摘 要： | 为了研究电迁移过程中焊点与焊盘界面金属问化合物(IMC)的变化,在28℃下,对无铅Sn3.0Ag0.5Cu焊点进行了6.5A直流电下的电迁移实验.结果发现,通电144h后,阳极侧IMC层变厚,平均达到10.12 μm;阴极侧IMC层大部分区域变薄至0.86μm,局部出现Cu焊盘的溶解消失,但在界面边缘处出现Cu3Sn5...
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| 关 键 词： | 电迁移 金属间化合物 异常堆积 Sn3.0Ag0.5Cu |
Abnormal accumulation of IMC at cathode during electromigration in SnAgCu solder joint |
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| CHANG Hong,LI Mingyu.Abnormal accumulation of IMC at cathode during electromigration in SnAgCu solder joint[J].Electronic Components & Materials,2011,30(4):50-52,58. |
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| Authors: | CHANG Hong LI Mingyu |
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| Affiliation: | CHANG Hong,LI Mingyu(State Key Lab of Advanced Welding Production Technology,Shenzhen Graduate School,Harbin Institute of Technology,Shenzhen 518055,Guangdong Province,China) |
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| Abstract: | In order to study the change of intermetallic compound(IMC) between solder joint and pad during electromigration,electromigration test was performed for Sn3.0Ag0.5Cu solder joint at 28 ℃ with a direct current of 6.5 A.The results show that,after 144 h electromigration,the IMC layer at anode thickens to 10.12 μm,while most part of the IMC layer at cathode thins to 0.86 μm and part of the Cu pad dissolves,however,an abnormal accumulation of Cu6Sn5 IMC is found at the fringe of cathode.The finite element analysis of temperature distribution in the solder joint indicates that the abnormal accumulation of IMC is due to that the thermomigration caused by temperature gradient dominates the partial migration process at cathode. |
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| Keywords: | electromigration intermetallic compound abnormal accumulation Sn3 0Ag0 5Cu |
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