| 无铅条件下PCBA可制造性初探 |
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| 引用本文： | 白云,刘艳新. 无铅条件下PCBA可制造性初探[J]. 电子工艺技术, 2004, 25(6): 247-251 |
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| 作者姓名： | 白云 刘艳新 |
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| 作者单位： | 北京装联电子工程有限工司,北京,100041;北京装联电子工程有限工司,北京,100041 |
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| 摘 要： | 在无铅条件下提高PCBA可制造性涉及的因素包括:PCB和元器件的制造、焊料(焊膏)的选用、设备的加工能力以及工艺技术等.本文通过分析PCBA可制造性的内涵,提出装联无铅化的关键所在,重点论述了在采用Sn-Ag-Cu和Sn-Cu钎料的条件下,实现无铅再流焊和无铅波峰焊的技术途径和对策.
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| 关 键 词： | PCBA装联 无铅化 无铅再流焊 无铅波峰焊 无铅手工焊 |
| 文章编号： | 1001-3474(2004)06-0247-05 |
| 修稿时间： | 2004-09-16 |
Research of PCBA Assemble in Lead Free |
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| BAI Yun,LIU Yan-xin. Research of PCBA Assemble in Lead Free[J]. Electronics Process Technology, 2004, 25(6): 247-251 |
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| Authors: | BAI Yun LIU Yan-xin |
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| Abstract: | Improving producibility of PCBA includes much factors, such as fabrication of PCB ,design of component, selection of solder, capability of equipment and technology of process. Analyse the producibility principle of PCBA, and critical techniques of lead free is proposed and researched. Finally, the research on the key impacts of Sn-Ag-Cu and Sn-Cu lead free solder and their implementation in lead free reflow soldering and lead free wave soldering is presented. |
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| Keywords: | PCBA assemble Lead Free Lead Free Reflow Soldering Lead Free Wave Soldering Lead Free Hand Soldering |
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