Joining of SiC Fiber‐Bonded Ceramics using Silver,Copper, Nickel,Palladium, and Silicon‐Based Alloy Interlayers |
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| Authors: | Rajiv Asthana Mrityunjay Singh Hua‐Tay Lin Tadashi Matsunaga Toshihiro Ishikawa |
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| Affiliation: | 1. Department of Engineering & Technology, University of Wisconsin‐Stout, , Menomonie, Wisconsin, 54751;2. Ohio Aerospace Institute, , Cleveland, Ohio, 44142;3. Materials Science and Technology Division, Oak Ridge National Laboratory, , Oak Ridge, Tennessee, 37831‐6068;4. Inorganic Specialty Products Research Laboratory, Ube Industries, Ltd., , Ube‐shi, 755‐8633 Japan |
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| Abstract: | SiC fiber‐bonded ceramics, SA‐Tyrannohex®, (SA‐THX) with perpendicular and parallel fiber orientations were brazed using Ag‐, Ni‐ and Pd‐base brazes, and four Si–X (X: Ti, Cr, Y, Ta) eutectics. Outcomes were variable, ranging from bonded joints through partially bonded to un‐bonded joints. Prominent Ti‐ and Si‐rich interfaces developed with Cusil‐ABA, Ticusil, and Copper‐ABA and Ni‐ and Si‐rich layers with MBF‐20. Stress rupture tests at 650 and 750°C on Cusil‐ABA‐bonded joints revealed a temperature‐dependent behavior for the perpendicular joints but not for the parallel joints with failure occurring at brazed interface. Higher‐use temperatures can be targeted with eutectic Si–Ti and Si–Cr alloys. |
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