Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect |
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Authors: | X.F. Zhang J.D. Guo J.K. Shang |
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Affiliation: | (1) Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, China;(2) Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA |
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Abstract: | Electromigration in the Ni/Sn-Zn/Cu solder interconnect was studied with an average current density of 3.51 × 104 A/cm2 for 168.5 h at 150°C. When the electrons flowed from the Ni side to the Cu side, uniform layers of Ni5Zn21 and Cu5Zn8 were formed at the Ni/Sn-Zn and Cu/Sn-Zn interfaces. However, upon reversing the current direction, where electron flow was from the Cu side to the Ni side, a thicker Cu6Sn5 phase replaced the Ni5Zn21 phase at the Ni/Sn-Zn interface, whereas at the Cu/Sn-Zn interface, a thicker β-CuZn phase replaced the Cu5Zn8 phase. |
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Keywords: | Electromigration coupling effect polarity intermetallic compound interfacial reaction |
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