| CMOS图像传感器凸点良率随机模型 |
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| 引用本文： | 田晨播. CMOS图像传感器凸点良率随机模型[J]. 电子与封装, 2011, 11(5): 13-18 |
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| 作者姓名： | 田晨播 |
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| 作者单位： | 中南大学物理学院;欧洲微电子中心(IMEC); |
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| 摘 要： | 倒装技术目前被应用在CMOS图像传感器当中,用以提高传感器感光层的填充系数.使用成熟的制备工艺,CMOS图像传感器中仍然有少量凸点失效.在高像素,小间距的CMOS图像传感器当中,凸点数目较大,无法逐一检测坏点,因此依靠菊链结构检测点阵.然而,菊链的检测结果与点阵良率之间的数量关系罕有涉及.文章根据菊链结构与特性,从0-...
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| 关 键 词： | 凸点良率 坏点 菊链 模型 |
Statistic Model for Bump Yield of CMOS Image Sensor |
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| TIAN Chen-bo. Statistic Model for Bump Yield of CMOS Image Sensor[J]. Electronics & Packaging, 2011, 11(5): 13-18 |
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| Authors: | TIAN Chen-bo |
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| Affiliation: | TIAN Chen-bo1,2(1.Physics School of Central South Univercity,Changsha 410012,China,2.IMEC,China) |
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| Abstract: | To improve the fill factor of detective die,flip chip technology has been used in producing COMS image sensors.The ineffective bumps exist even in the mature process technology.In those CMOS image sensors with small pitch and numerous pixels,the ineffective bumps cannot be detected one by one as the number of the bumps is quite large.Therefore daisy chain by connecting the bumps is used to detect the bump array.However,few models were built to analyze the relation between daisy chain and bump yield.In this ... |
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| Keywords: | bump yield ineffective bump daisy chain statistic model |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
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