| 大功率LED用封装基板研究进展 |
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| 引用本文： | 欧阳雪琼,王双喜,郑琼娜,张红霞.大功率LED用封装基板研究进展[J].电子与封装,2011,11(4):1-5,16. |
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| 作者姓名： | 欧阳雪琼 王双喜 郑琼娜 张红霞 |
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| 作者单位： | 佛山市华南精细陶瓷技术研究开发中心;佛山市地天泰新材料技术有限公司; |
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| 基金项目： | 广东科技计划项目(编号:201010220100349) |
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| 摘 要： | LED被称为第四代照明光源及绿色光源,近几年来该产业发展迅猛.由于LED结温的高低直接影响到LED的出光效率、器件寿命和可靠性等,因此散热问题已经成为大功率LED产业发展的瓶颈.文章阐述了大功率LED基板的封装结构和散热封装技术的发展状况,从基板的结构特点、导热性能及封装应用等方面分别介绍了金属芯印刷电路基板、覆铜陶瓷...
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| 关 键 词： | 大功率LED 散热 封装基板 封装结构 |
Development of Package Substrates for High Power LED |
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| OUYANG Xue-qiong,WANGShuang-xi,ZHENG Qiong-na,ZHANG Hong-xia.Development of Package Substrates for High Power LED[J].Electronics & Packaging,2011,11(4):1-5,16. |
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| Authors: | OUYANG Xue-qiong WANGShuang-xi ZHENG Qiong-na ZHANG Hong-xia |
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| Affiliation: | OUYANG Xue-qiong1,WANG Shuang-xi1,ZHENG Qiong-na1,ZHANG Hong-xia2(1.Foshan South China Institute of Fine Ceramics,Foshan 528000,China,2.Foshan New Material Technology Co.,LTD.,China) |
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| Abstract: | LED is called the fourth generation lighting and green light source,which has been in a rapid development.Light efficiency,device lifetime and reliability are directly affected by the junction temperature of LEDs.Thus,heat dissipation of LEDs has been a bottleneck of the industrial development.Developing status of package structure and heat dissipation package technique for high power LEDs was introduced.Several kinds of package substrates,including metal core printed circuit board,copper-clad ceramic subst... |
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| Keywords: | high-power LED heat dissipation package substrate package structure |
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