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Pulse and pulse reverse plating—Conceptual, advantages and applications |
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| Authors: | MS Chandrasekar |
| Affiliation: | Central Electrochemical Research Institute, Karaikudi 630006, TN, India |
| Abstract: | A review on pulse and pulse reverse techniques for electrodeposition have been attempted. Pulse electrodeposition (PED) of some metals and alloys are reported. The effects of mass, transport, electrical double layer pulse parameters and current distribution on surface roughness and morphology are presented. Applications, advantages and disadvantages of PC and PRC techniques are discussed along with theoretical aspects and mechanism. |
| Keywords: | TON Pulse ON-time (ms) TOFF Pulse OFF-time (ms) IP Pulse peak current density (A dm&minus 2) PC Pulse current PED Pulse electrodeposition PRC Pulse reverse current DC Direct current PCB Printed circuit board γ Duty cycle f Frequency T Cycle time (or period) (ms) IA Average current density in PC (A dm&minus 2) īA Average current in PRC (A dm&minus 2) IC Cathodic current density (A dm&minus 2) IAA Anodic current density (A dm&minus 2) TC Cathodic (forward) time (ms) IF Faradic current (A dm&minus 2) tc Charging time (ms) tD Discharging time (ms) IL Pulse limiting current density (A dm&minus 2) IG DC limiting current density (A dm&minus 2) |
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