Manufacturing of integrative membrane carriers by novel powder injection molding

Although offering distinctive economic benefits the mass fabrication of carrier devices incorporating membranes as quasi-monolithic devices reveals strong technological challenges. Powder injection molding would be an effective process for this purpose, however, manufacturing parts of considerable wall thickness variations and to meet strong precision demands remains problematic. To evaluate novel ways of process conducts as well as to determine influencing parameters a demonstrator design had been developed which enabled the generation of thin membranes by controlled piston movement. Suitable lay-out of the runner system had been determined with the help of simulation calculations. The combined injection + embossing process conduct enabled to reduce minimum membrane thickness to about a half. Investigation of parameter influence showed that embossing force and gap width before injection have an ameliorative effect on membrane quality whereas the embossing delay time had no significant impact.