Characterizing mechanical behaviors of a flexible AMOLED during the debonding process

The stress distribution of a flexible active-matrix organic light-emitting diode (AMOLED) display during the debonding process was investigated using finite element analysis. During the fabrication of an AMOLED display, an AMOLED with a polyimide (PI) substrate is detached from a glass carrier; this is a critical process and generally results in failure of the AMOLED. To enhance the yielding rate of AMOLEDs, their stress states generated during the debonding process must be reduced. The interfacial fracture behavior between the PI substrate and glass carrier was characterized on the basis of bimaterial fracture mechanics, and the fracture toughness associated with mode mixity determined through peeling tests was considered a criterion for detaching the AMOLED from the glass carrier. The stress distribution of the AMOLED at the inception of debonding crack extension was evaluated according to fracture toughness. In addition, the parameters possibly influencing the stress states of the AMOLED in the debonding process are discussed.