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SiO2含量对PTFE/SiO2复合材料性能的影响
引用本文:庞翔,袁颖,肖勇,童启铭,李攀敏,邓新峰. SiO2含量对PTFE/SiO2复合材料性能的影响[J]. 压电与声光, 2012, 34(4): 577-580
作者姓名:庞翔  袁颖  肖勇  童启铭  李攀敏  邓新峰
作者单位:电子科技大学电子薄膜与集成器件国家重点实验室,四川 成都,610054
摘    要:采用类似于粉末冶金工艺,制备了无定形SiO2填充聚四氟乙烯(PTFE)复合材料,并对其进行了热、介电性能测试和SEM分析表征。系统研究了(1-x)PTFE-xSiO2(x为质量比)复合介质材料中,不同x值(x=0.35,0.40,0.45,0.50,0.55)对材料结构和性能的影响。结果表明,复合材料的密度随着SiO2含量的增加而减少,吸水率、热膨胀系数、介电常数和介电损耗随着SiO2含量的增加而增加。当SiO2质量分数为50%时,PTFE能很好地在SiO2表面形成一层包覆层,此时复合材料具有合适的热膨胀系数(17μ℃-1)、介电常数(2.74)和低介电损耗(0.002)。

关 键 词:复合材料  SiO2  聚四氟乙烯  热膨胀系数  介电性能

Effects of SiO2 Content on the Properties of PTFE/SiO2 Composites
PANG Xiang,YUAN Ying,XIAO Yong,TONG Qiming,LI Panmin and DENG Xinfeng. Effects of SiO2 Content on the Properties of PTFE/SiO2 Composites[J]. Piezoelectrics & Acoustooptics, 2012, 34(4): 577-580
Authors:PANG Xiang  YUAN Ying  XIAO Yong  TONG Qiming  LI Panmin  DENG Xinfeng
Affiliation:(State Key Lab.of Electronic Thin Films and Integrated Devices,University of Electronic Science and Technology of China,Chengdu 610054,China)
Abstract:The amorphous SiO2 filled PTFE composite materials were prepared by using the technology similar to the powder metallurgy.The thermal and dielectric properties of the composites were measured.Also,the microstructure evolution of the composites was characterized by the scanning electron microscopy(SEM).The effects of the different xvalue(xis the mass ratio,x=0.35,0.40,0.45,0.50,0.55) on the microstructure and dielectric properties of(1-x) PTFE-xSiO2 composite dielectric material were investigated.It was found that the density of the composite decreased as the content of SiO2 increased.On the other hand,the water absorption,thermal expansion coefficient,dielectric constant and dielectric loss were increased with the SiO2 content increasing.When the content of SiO2 reached 50%,PTFE could be well coated by the SiO2layers,and the composites showed suitable thermal expansion coefficient(17 μ ℃-1),dielectric constant(2.74) and low dielectric loss(0.002 4).
Keywords:composite material  SiO2  polyfluortetraethylene(PTFE)  thermal expansion coefficient  dielectric property
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