| Sn-58Bi-(0~3)Ga/Cu润湿剪切性能及界面化合物的研究 |
| |
| 引用本文： | 杨斌,陈剑明,邬善江,李明茂,张建波. Sn-58Bi-(0~3)Ga/Cu润湿剪切性能及界面化合物的研究[J]. 材料导报, 2017, 31(14): 92-95, 104. DOI: 10.11896/j.issn.1005-023X.2017.014.019 |
| |
| 作者姓名： | 杨斌 陈剑明 邬善江 李明茂 张建波 |
| |
| 作者单位： | 1. 江西理工大学材料科学与工程学院,赣州,341000;2. 江西省有色金属加工工程技术研究中心,赣州,341000 |
| |
| 基金项目： | 江西省自然科学基金(20161BAB206137) |
| |
| 摘 要： | 采用熔炼铸造法制备了Sn-58Bi-(0~3)Ga焊料合金,研究了Ga元素含量对合金熔化特性、润湿和剪切性能的影响,并利用扫描电镜研究了Sn-58Bi-(0~3)Ga/Cu基体界面特征。结果表明,Ga元素的添加降低了合金的熔点,增大了合金的熔程,相比于Sn-58Bi合金,Sn-58Bi-1Ga焊料合金在铜基体的铺展率显著下降,剪切强度略有提高,随着Ga含量提高至2%、3%,合金的铺展率略有下降,剪切强度显著降低;Sn-58Bi/Cu界面主要组成元素为Sn和Cu,Sn-58Bi-(1~3)Ga/Cu界面上出现了明显的Ga和Cu元素偏聚界面层,结合特征点的能谱成分分析,确定了界面化合物的组成。
|
| 关 键 词： | Sn-Bi合金 熔化特性 剪切强度 铺展率 界面化合物 |
Study on Wetting Shearing Properties and Interface Compounds of Sn-58Bi-(0-3)Ga/Cu |
| |
| YANG Bin,CHEN Jianming,WU Shanjiang,LI Mingmao and ZHANG Jianbo. Study on Wetting Shearing Properties and Interface Compounds of Sn-58Bi-(0-3)Ga/Cu[J]. Materials Review, 2017, 31(14): 92-95, 104. DOI: 10.11896/j.issn.1005-023X.2017.014.019 |
| |
| Authors: | YANG Bin CHEN Jianming WU Shanjiang LI Mingmao ZHANG Jianbo |
| |
| Affiliation: | School of Material Science and Engineering, Jiangxi University of Science and Techonology, Ganzhou 341000,School of Material Science and Engineering, Jiangxi University of Science and Techonology, Ganzhou 341000,School of Material Science and Engineering, Jiangxi University of Science and Techonology, Ganzhou 341000,Jiangxi Nonferrous Metal Processing Engineering Technology Research Center, Ganzhou 341000 and Jiangxi Nonferrous Metal Processing Engineering Technology Research Center, Ganzhou 341000 |
| |
| Abstract: | The Sn-58Bi-(0-3)Ga alloys were prepared by melting and casting method.The research was focused on the effect of Ga content on properties of melting, wetting and shear strength subsequently.The characteristic of interface between Sn-58Bi-(0-3)Ga and Cu was investigated as well.The results showed that the addition of Ga led to the decrease of the melting point and the increase of melting range.Compared with the alloy without Ga addition, the spreading rate of Sn-58Bi-1Ga on Cu substrate decreased obviously while the shear strength increased slightly.Along with the content of Ga increasing to 2% and 3%, the shear strength decreased significantly and the spreading rate decreased appreciably.Cu and Sn elements were the main components of the Sn-58Bi/Cu interface, while Ga and Cu segregated greatly on the interface between Sn-58Bi-(1-3)Ga and Cu.In addition, the interface compounds were determined via energy dispersion spectrum (EDS) analysis at last. |
| |
| Keywords: | Sn-Bi alloy melting characteristic shear strength spreading rate interface compounds |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
| 点击此处可从《材料导报》浏览原始摘要信息 |
|
点击此处可从《材料导报》下载全文 |
|
