石墨烯含量对铜基石墨烯复合材料力学和电学性能的影响

为改进铜基复合材料的力学和电学性能,向铜基体分别加入0.2%、0.3%、0.4%(质量分数)的石墨烯,充分混合后,采用放电等离子烧结技术(SPS)制备了石墨烯/铜(G/Cu)复合材料。通过扫描电镜(SEM)、拉曼(Raman)光谱和XRD等表征了复合材料微观结构,测试了其硬度、屈服强度、抗压强度和导电率等性能,以确定石墨烯在铜基体中的合适掺杂量。结果表明:随着石墨烯含量的降低,其力电性能显著提高。当石墨烯质量分数为0.2%时,G/Cu复合材料的综合性能(力学及电学性能)达到最好匹配,实现了铜基材料的高强度、高导电性:其抗压强度和屈服强度分别为557.23 MPa和256 MPa,相对于用SPS方法制备的纯铜分别提高了59.21%和70.7%;电导率为52.3 MS/m,其IACS高达91.8%。

Effect of Graphene Content on the Mechanical and Electrical Properties of Graphene-reinforced Copper Matrix Composites

In order to improve mechanical and electrical properties of the copper matrix composites, the 0.2wt%,0.3wt%,0.4wt% of graphene have been added into copper matrix. The graphene/copper composites was prepared by SPS method after the graphene and copper powder being mixed. The microstructures of the composites were observed by SEM, Raman and XRD, respectively. And the hardness, yield strength, compressive strength and conductivity were tested to determine the optimal content of graphene in copper substrate. The results show that the electronic properties of the composites were improved significantly with the decrease of the graphene content. When the graphene content was 0.2wt%,the comprehensive performances of graphene/copper composite material (mechanical and electrical properties) were the best. The compressive strength and yield strength were 557.23 MPa and 256 MPa, respectively, which were increased by 59.21% and 70.7% respectively, compared to pure copper prepared by the SPS method. The electrical conductivity was 52.3 MS/m and the IACS was as high as 91.8%.