自修复微胶囊分散对复合材料拉伸性能的影响

为改善亚乙基降冰片烯(ENB)自修复微胶囊在环氧树脂(Epoxy)中的分散性, 采用KH560偶联剂对ENB微胶囊表面进行处理, 探讨KH560改性ENB 微胶囊(KH560-ENB)在Epoxy材料中的分散性及KH560-ENB环氧树脂材料(KH560-ENB/Epoxy)的拉伸性能。结果表明: 对未改性的ENB微胶囊树脂复合材料(ENB/Epoxy), 当ENB微胶囊与Epoxy质量比小于或等于5%时, ENB/Epoxy的拉伸断裂强度、拉伸模量以及断裂伸长率均随ENB微胶囊与Epoxy质量比的增加而降低, 但经不同温度预固化后, ENB/Epoxy复合材料拉伸指标初始下降速率均不同; KH560-ENB微胶囊在Epoxy中累积分布线性拟合相关系数为0.9945, 接近于1, 说明KH560-ENB微胶囊在Epoxy中分散性好, 且KH560-ENB/Epoxy复合材料的拉伸断裂强度提高19.1%, 拉伸模量提高6.6%; 对KH560-ENB/Epoxy复合材料的SEM断面观察结果表明, KH560-ENB微胶囊与Epoxy界面粘接良好。

Effect of the dispersion of self-healing microcapsules to tensile properties of microcapsules filled composites

In order to improve the dispersion of ethylidene-2-norbornene (ENB) based self–healing microcapsules in the epoxy, KH560 coupling agent was chosen to modify the surface of ENB microcapsules in this paper. Therefore, the dispersion of KH560/ENB microcapsules and their influence on tensile property of KH560/ENB-Epoxy composites were both studied. The results show that, tensile properties of ENB-Epoxy composites including tensile fracture strength, tensile modulus, and elongation at break, are all decreased when mass fraction of ENB microcapsules to epoxy is increasing to no more than 5wt%; falling slopes of those three tensile properties are varying with pre-curing temperature of ENB-Epoxy composites. And the linear coefficient of cumulative distribution of KH560/ENB microcapsule in epoxy is 0.9945, nearly to 1, showing better dispersion. Furthermore, tensile fracture strength and tensile modulus of KH560/ENB-Epoxy composites are increased by 19%, 6.59%, respectively. According to SEM observations of KH560/ENB-Epoxy cross section, the interface between KH560/ENB microcapsules and epoxy is well bonded. 1 (1. School of Textiles, Tianjin Polytechnic University, Tianjin 300387, China;2. Key Laboratory ofAdvanced Textile Composite Materials, Tianjin Polytechnic University, Tianjin 300387, China)