| Bi对Sn3.5Ag共晶合金钎料性能的影响 |
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| 引用本文： | 胡志田,徐道荣.Bi对Sn3.5Ag共晶合金钎料性能的影响[J].焊接技术,2006,35(4):46-48. |
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| 作者姓名： | 胡志田 徐道荣 |
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| 作者单位： | 武昌造船厂,湖北,武汉,430060;合肥工业大学,材料科学与工程学院,安徽,合肥,230009 |
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| 摘 要： | 研究了添加Bi元素对Sn3.5Ag共晶合金钎料性能的影响,对Sn3.5AgxBi(x=0,3,5,7)钎料的熔点、力学性能和热蠕变性能与传统Sn37Pb钎料作了对比试验分析.结果表明:Sn3.5Ag5Bi钎料具有良好的综合性能,实用价值较高,Bi的添加量应控制在5%左右,过多的Bi元素会导致钎料的液固相线温度差增大,韧性下降.
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| 关 键 词： | Sn3.5AgxBi 钎料 性能 |
| 文章编号： | 1002-025X(2006)04-0046-03 |
| 收稿时间： | 2005-09-30 |
| 修稿时间： | 2006-06-01 |
Effect of adding Bi element on Sn3.5Ag eutectic alloy solder |
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| HU Zhi-tian,XU Dao-rong.Effect of adding Bi element on Sn3.5Ag eutectic alloy solder[J].Welding Technology,2006,35(4):46-48. |
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| Authors: | HU Zhi-tian XU Dao-rong |
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| Abstract: | The effect of adding Bi element on Sn3.5Ag eutectic alloy solder is analyzed. Comparison testing analysis in melting point, mechanical and heat creep property between Sn3.5AgxBi (x=0,3,5,7)and Sn37Pb solder is conducted. The experiment result demonstrates that Sn3.5AgxBi solders have better synthesized properties and solid application value, but the best range of content of Bi is around 5%, overmuch Bi element can induce the increasing of the gap temperature of liquid and solid phase of the solders and it can also weaken the toughness. |
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| Keywords: | Sn3 5AgxBi solder property |
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