| Ni-W-SiC纳米复合电镀工艺的研究 |
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| 引用本文： | 王晋春,程旭东,李丹虹,杨章富,欧阳贵. Ni-W-SiC纳米复合电镀工艺的研究[J]. 材料工程, 2006, 0(3): 25-28 |
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| 作者姓名： | 王晋春 程旭东 李丹虹 杨章富 欧阳贵 |
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| 作者单位： | 武汉理工大学,材料复合新技术国家重点实验室,武汉,430070;武汉材料保护研究所,武汉,430030 |
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| 摘 要： | 采用一种新型的分散方法促使纳米SiC在镀液中的均匀有效分布.初步探讨了工艺参数对复合镀层的影响,着重研究阴极电流密度对Ni-W-SiC纳米复合镀层表面形貌、断面形貌、n-SiC共析量和显微硬度的影响.结果表明:在其他工艺不变的条件下,选择适当的电流密度可制备出形貌良好、成分均匀、硬度较高的纳米复合镀层.
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| 关 键 词： | 纳米复合电镀 共析量 表面形貌 显微硬度 |
| 文章编号： | 1001-4381(2006)03-0025-04 |
| 收稿时间： | 2005-05-25 |
| 修稿时间： | 2005-11-15 |
Study on Ni-W-SiC Nanometer Electrodeposition Process |
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| WANG Jin-chun,CHENG Xu-dong,LI Dan-hong,YANG Zhang-fu,OUYANG Gui. Study on Ni-W-SiC Nanometer Electrodeposition Process[J]. Journal of Materials Engineering, 2006, 0(3): 25-28 |
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| Authors: | WANG Jin-chun CHENG Xu-dong LI Dan-hong YANG Zhang-fu OUYANG Gui |
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| Affiliation: | 1 State Key Laboratory of Advanced Technology for Materials Synthesis and Progressing, Wuhan University of Technology, Wuhan 430070, China; 2 Wuhan Research Institute of Materials Protection, Wuhan 430030 , China |
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| Abstract: | A new disperse method was applied to disperse n-SiC to avoid conglomerating. The effect of process parameters on the nano-composite coating was presented. The influence of cathodic current density on surface morphology, section morphology, n-SiC co-deposition amount and microhardness of nano-composite coating was mainly studied. The result shows that good morphology, n- SiC particle dispersed uniformly and highly microhardness value of nano-composite coatings can be prepared under proper current density when other process conditions are same. |
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| Keywords: | nanometer electrodeposition co-deposition amount surface morphology microhardness |
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