| 环氧-玻纤布基板材料的薄型化技术 |
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| 引用本文： | 祝大同.环氧-玻纤布基板材料的薄型化技术[J].印制电路信息,2008,54(1):12-16,38. |
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| 作者姓名： | 祝大同 |
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| 摘 要： | 近年，薄型环氧-破纤布基板材料的开发、应用成为一个热门课题。文章对薄型化CCL的产生背景、三大主要应用领域开拓和对它的性能要求，以及对原材料技术新发展的驱动做一讨论。
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| 关 键 词： | 薄型化覆铜板 印制电路板 HDI多层板 挠性覆铜板 IC封装基板 |
| 文章编号： | 1009-0096(2008)01-0012-05 |
Thickness Decreasing Technology of Epoxy/Glass Fiber Laminate Materials |
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| ZHU Da-tong.Thickness Decreasing Technology of Epoxy/Glass Fiber Laminate Materials[J].Printed Circuit Information,2008,54(1):12-16,38. |
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| Authors: | ZHU Da-tong |
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| Affiliation: | ZHU Da-tong |
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| Abstract: | Technology of thin epoxy/glass fiber laminate material is getting focal problem. In the paper, the background of thin CCL, three main application field, requirement of performance, drive force to technology develop- ment of raw material were reviewed. |
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| Keywords: | thin copper clad laminate PCB HDI FCL IC packaging substrate |
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