Process optimization of electroless copper plating and its influence on electrochemical properties of AB5-type hydrogen storage alloy |
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Authors: | Journal of Rare Earths |
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Affiliation: | School of Materials & Metallurgy, Northeastern University, Shenyang 110004, China |
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Abstract: | The amount of Cu coating by chemical plating was investigated based on quadratic regression orthogonal experimental design being adapted to the variation law of temperature, pH value and Ni2+ concentration, and the relevant regression equation was expressed as y=2.1609+0.5295×10?3T2-0.0342P2-0.0265N2+0.0023TP+0.0020TH+0.0199PN-0.0959T+0.3814P-0.2073N. The results showed that the deposition rate augmented with the increasing in temperature, pH value and Ni2+ concentration. The experimental parameters of the optimal coating were temperature 75 °C, pH value 8.5 and Ni2+ concentration 1.2 g/L. The electrochemical tests indicated that the cycle stability increased from 60.66% to 75.58%, indicating that the treated alloy exhibited better corrosion resistance. |
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Keywords: | hydrogen storage alloy electroless copper plating electrochemical performance rare earths |
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