无铅焊料热风整平（锡／镍／铜）可焊性问题的探讨

无铅热风整平作为一种PCB新的无铅表面处理方式,绿色环保先进,很受业界青睐。但是PCB至客户端上锡不良却是一个问题。其不良率时高时低,而且反复发生,多数初采用此工艺的业者无法马上找到问题所在;同时目前国内关于此问题的研究较少,可借鉴文献不足。文章依据实际工作中发生的问题,及通过与星马公司技术人员的探讨成功解决的实例,对无铅热风整平可焊性问题从原理、过程、影响IMC厚度的因素几个方面进行了详细的分析。最后对如何在生产过程中进行管理给出了建议。

Solderability of Sn/Ni/Cu Lead-Free Solder as a HASL Bare Board Final Finish

As a new lead-free surface finish, lead-free solder is very popular to the PCB industry with its advanced and environmentally friendly features. However, poor solderability is a big problem we are faced with. Since the poor solderability happens repeatedly at different rate, it is difficult to identify its cause immediately. What＇s more nowadays there are few relevant books or papers for reference. On the base of the cases really encountered during work and the successful solutions which are got through the joint efforts by our company and Xingma Company, the author gives a deep and overall analysis on the solderability of lead-free solder from the perspectives of theory, process and influencing factors. This thesis intends to offer some constructive suggestions for the development of PCB and SMT industry.