Sn-Ag-Cu系无铅焊锡的力学性能和实用性能

研究添加稀土Ce对Sn-Ag-Cu合金的力学性能和实用性能的影响,利用光学显微镜、SEM、EDX对合金的组织、形貌、成分进行分析。结果表明,在Sn-Ag-Cu系无铅焊锡中添加稀土Ce可以细化合金组织,使合金成分分布更加均匀;稀土Ce的添加可以明显提高合金的延伸率;添加Ce后延伸率提高了6.1%,从而使力学性能大大提高;适量稀土的加入使焊料与基体结合更加紧密,外观平整,对合金的实用性能有很大提高。

Mechanical Properties and Practical Properties of Sn-Ag-Cu Lead-free Solder Alloys

Effects on mechanical properties and practicality of Sn-Ag-Cu lead-free solder alloys were investigated by adding a suitable amount of Ce. The microstructure, morphology and compositions of alloys were analyzed by optical microscope, SEM and EDX. The results show that adding a suitable amount of Ce into Sn-Ag-Cu solders would make the structure of alloy fined, and the distribution of alloy structure become more homogeneous. Moreover, addition of Ce can distinctly improve ductility, the elongation ratio enhanced 6.1% after adding rare earch Ce, then making mechanical properties promoted greatly. The combination between solder alloys and substrate is tighter and the facieses are smoother by adding appropriate Ce, leading to practical properties advanced.