| 三维微电子学综述 |
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| 引用本文： | 李文石,钱敏,黄秋萍. 三维微电子学综述[J]. 微电子学, 2004, 34(3): 227-230 |
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| 作者姓名： | 李文石 钱敏 黄秋萍 |
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| 作者单位： | 苏州大学,电子信息学院,江苏,苏州,215021 |
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| 摘 要： | 三维微电子学主要研究三维集成电路的设计与制造。文章讨论了三维集成电路的概念、发明思想、结构、优点、制造及其挑战和应用等。三维微电子技术必将成为未来发展的新兴技术。
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| 关 键 词： | 三维微电子学 三维集成电路 集成电路工艺 |
| 文章编号： | 1004-3365(2004)03-0227-04 |
An Overview of Three-Dimensional Microelectronics |
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| LI Wen-shi,QIAN Min,HUANG Qiu-ping. An Overview of Three-Dimensional Microelectronics[J]. Microelectronics, 2004, 34(3): 227-230 |
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| Authors: | LI Wen-shi QIAN Min HUANG Qiu-ping |
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| Abstract: | Three-dimensional microelectronics focuses on the design and fabrication technology for 3-D integrated circuits. The concept, ideas, structures, merits, fabrication technology, challenges and applications of 3-D integrated circuits are reviewed in the paper. 3-D microelectronics is becoming an emerging science and technology for the future. |
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| Keywords: | 3-D microelectronics 3-D integrated circuit IC process technology |
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