| 对PCB基板材料重大发明案例经纬和思路的浅析（1） |
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| 引用本文： | 祝大同.对PCB基板材料重大发明案例经纬和思路的浅析（1）[J].印制电路信息,2006(12):7-14. |
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| 作者姓名： | 祝大同 |
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| 摘 要： | 文章对日本近二十年的多项PCB基板材料方面的重大成果案例进行了分析研究,以达到提高我国CCL业创新能力和技术水平的目的。
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| 关 键 词： | 印制电路板 覆铜板 PCB基板材料 |
Analysis of Thoughts in Major Achievement of PCB Substrate Materials (Ⅰ) |
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| Zhu Datong.Analysis of Thoughts in Major Achievement of PCB Substrate Materials (Ⅰ)[J].Printed Circuit Information,2006(12):7-14. |
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| Authors: | Zhu Datong |
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| Abstract: | Japanese great achievement cases about PCB substrate materials in recent 20 years were reviewed inthis paper to reach the goal of improving innoveation ability and technique level of domestic CCL industry. |
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| Keywords: | printed circuit board(PCB) copper clad laminate(CCL) PCB substrate |
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