| SPS方法制备铜/金刚石复合材料 |
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| 作者姓名： | 张毓隽 童震松 沈卓身 |
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| 作者单位： | 1.北京科技大学材料科学与工程学院, 北京 100083 |
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| 摘 要： | 采用放电等离子烧结(SPS)方法制备出高体积分数的铜/金刚石复合材料,并对复合材料的致密度、热导率和热膨胀系数等进行了研究.结果表明,采用该方法制备的铜/金刚石复合材料微观组织均匀,致密度分布为94%~99%,最高热导率为305W·(m·K)-1,热膨胀系数与常见电子半导体材料相匹配,能够满足电子封装材料的要求.
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| 关 键 词： | 复合材料 热导率 热膨胀系数 电子封装 放电等离子烧结 |
| 收稿时间： | 2008-09-28 |
Preparation of Cu/diamond composites by spark plasma sintering |
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| Authors: | ZHANG Yu-juan TONG Zhen-song SHEN Zhuo-shen |
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| Affiliation: | 1.School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China |
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| Abstract: | High volume fraction Cu/diamond composites were successfully prepared by spark plasma sintering (SPS). Their relative density, thermal conductivity and coefficient of thermal expansion (CTE) were investigated. It is found that the composites have a uniform microstructure, with the relative density from 94% to 99%, the highest thermal conductivity of 305 W· (m·K)-1, and the CTE matching with common electronic semiconductor materials. All these properties can meet the demands of electronic packaging materials. |
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| Keywords: | composites thermal conductivity coefficient of thermal expansion electronic packaging spark plasma sintering |
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