Electromigration in Cu-Cored Sn-3.5Ag-0.7Cu Solder Interconnects Under Current Stressing |
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| Authors: | Xianzhang Sa Wei Zhou Ping Wu |
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| Affiliation: | 1. Department of Applied Physics, Institute of Advanced Materials Physics, Tianjin Key Laboratory of Low Dimensional Materials Physics and Preparing Technology, Faculty of Science, Tianjin University, Tianjin, 300072, People’s Republic of China
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| Abstract: | The effect of electromigration in Cu-cored Sn-3.5Ag-0.7Cu solder interconnects under current stressing was investigated. After current stressing at a density of 2 × 104 A/cm2, some Cu6Sn5 intermetallic compounds accumulated abnormally on the surface of the solder interconnect. The abnormal accumulation phenomenon was explained by the mechanism that thermomigration dominated the migration process. Furthermore, some Cu6Sn5 extrusions appeared on the cathode-side surface of the solder interconnect due to the compressive stresses induced by electromigration and thermomigration. |
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