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Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys
Authors:Leonardo R. Garcia   Wislei R. Osório   Leandro C. Peixoto  Amauri Garcia
Affiliation:(1) College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016 Nanjing, China;(2) Harbin Welding Institute, 150080 Harbin, China;(3) The 14th Research Institute, China Electronics Technology Group Corporation, 210013 Nanjing, China;
Abstract:A comparative experimental study of the main features of the eutectic Sn-Pb alloy and Sn-Zn alloys was carried out with a view to application of the latter alloys as alternative solder materials. The resulting microstructures, mechanical properties (ultimate tensile strength and elongation), and wettability behavior (spreading area and contact angle) of a hypoeutectic Sn-Zn (Sn-4wt.%Zn), a hypereutectic Sn-Zn (Sn-12wt.%Zn), and the eutectic Sn-9wt.%Zn alloy were examined and compared with the corresponding results of the conventional Sn-40wt.%Pb solder alloy. It was found that, of the Sn-Zn alloys examined, the eutectic Sn-9wt.%Zn alloy offers a compromise between lower wettability and higher mechanical strength.
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