电子陶瓷表面化学镀Ni-B合金的研究 |
| |
引用本文: | 闫洪.电子陶瓷表面化学镀Ni-B合金的研究[J].电子元件与材料,1997,16(1):53-56. |
| |
作者姓名: | 闫洪 |
| |
摘 要: | 研究采用以硼氢化钠为还原剂的化学镀镍溶液,在电子陶瓷基体上镀覆了Ni-B合金镀层。测试结果表明:该镀层的可焊性极好,与陶瓷基体的结合强度较高
|
关 键 词: | 镍硼合金 化学镀 陶瓷 |
修稿时间: | |
Study of Electroless Plated Ni B Alloy on Surface of Electronic Ceramics |
| |
Abstract: | A Ni B alloy coating bas been plated on electronic ceramic body in chemical nickel plating solution by use of natrium borohydride as a reducer. Test results show that the coating has excellent weldability and high adhesive strength to the ceramic body. |
| |
Keywords: | Ni B alloy electroless plating ceramics |
本文献已被 维普 等数据库收录! |