基于FPGA的BGA焊点健康管理原理与实现 |
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引用本文: | 田园,孙靖国,李大鹏. 基于FPGA的BGA焊点健康管理原理与实现[J]. 计算机测量与控制, 2015, 23(10): 14-14 |
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作者姓名: | 田园 孙靖国 李大鹏 |
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作者单位: | 中航工业计算所,中航工业计算机所,中航工业计算所 |
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基金项目: | 航空科学基金(20101931005) |
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摘 要: | 针对BGA封装的FPGA焊点故障频发的问题,提出了一种基于FPGA的BGA焊点失效监测模型及实现方法;对FPGA的BGA焊点失效原理进行了分析;基于IPC7095B确定了焊点易失效区域,并依据欧姆定律构建了检测模型;基于Xilinx的FPGA实现了对焊点健康信息的管理,并根据不同的检测标准对检测情况进行了比较
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关 键 词: | BGA FPGA 焊点 健康管理 |
收稿时间: | 2015-03-31 |
修稿时间: | 2015-05-04 |
Theory and implementation of BGA solder joint health management based on FPGA |
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Abstract: | For the question of frequency occurrence of solder joint failure for FPGA BGA package, presents a FPGA-based BGA solder joint failure monitoring model and implementation; analysis of the FPGA"s BGA solder joint failures principle; specify the solder area prone to failure based IPC7095B, and constructed in accordance with Ohm"s law detection model; based on Xilinx FPGA implementation of health information management for joints, and different testing standards were compared. |
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Keywords: | BGA, FPGA, solder joint, health management |
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