| LED导热胶片性能研究与评估 |
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| 引用本文： | 庄美琳,王峰,钱晶,钱雯磊,李抒智,马可军.LED导热胶片性能研究与评估[J].电子与封装,2011,11(12):25-28. |
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| 作者姓名： | 庄美琳 王峰 钱晶 钱雯磊 李抒智 马可军 |
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| 作者单位： | 上海半导体照明工程技术研究中心,上海,201203 |
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| 摘 要： | 大功率LED器件的基座与散热基板之间的接触热阻会阻碍其芯片PN结与散热基板之间的热传导，从而影响到器件的光、色、电性能及寿命。导热胶片用于填充材料界面之间接合或接触时产生的微空隙及表面凹凸不平的孔洞，是减小接触热阻、降低芯片PN结温度的有效手段。文章主要通过测定热阻值来开展对导热胶片在实际应用中导热性能的研究。通过阻容...
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| 关 键 词： | 导热胶片 LED 热阻 阻容模型 加热曲线 传热结构 |
The Research and Evaluation of LED Thermal Interface Materials |
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| ZHUANG Mei-lin,WANG Feng,QIAN Jing,QIAN Wen-lei,LI Shu-zhi,MA Ke-jun.The Research and Evaluation of LED Thermal Interface Materials[J].Electronics & Packaging,2011,11(12):25-28. |
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| Authors: | ZHUANG Mei-lin WANG Feng QIAN Jing QIAN Wen-lei LI Shu-zhi MA Ke-jun |
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| Affiliation: | (Shanghai Research Center of Engineering and Technology for Solid-State Lighting, Shanghai 201203,China) |
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| Abstract: | Contact resistance exists in the contact face between LED （light emitting diode） substrate and heat sink, which will hinder thermal conducting from PN junction to heat sink and affect its light, color, ele ctrical performance and lifetime. Thermal interface materials can be used to fill the holes and gaps between the contact face. This method can reduce contact thermal resistance and the temperature of PN junction. The thermal properties of thermal interface materials were studied by measuring its thermal resistance. In addition, its role in the LED cooling system can be analyzed by RC model, heating curve, structure function. This paper proposed a new testing method of thermal interface materials. |
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| Keywords: | thermal interface materials LED thermal resistance RC model heating curve structurefunction |
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