| 金锡共晶烧结工艺及重熔孔隙率变化研究 |
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| 引用本文： | 葛秋玲,丁荣峥,明雪飞. 金锡共晶烧结工艺及重熔孔隙率变化研究[J]. 电子与封装, 2011, 11(12): 4-7 |
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| 作者姓名： | 葛秋玲 丁荣峥 明雪飞 |
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| 作者单位： | 无锡中微高科电子有限公司,江苏无锡,214035 |
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| 摘 要： | 文章论述了金锡共晶烧结工艺在功率器件焊接中的应用，分析了金锡共晶烧结温度、时间和压力对芯片粘接质量的影响。同时分析了金锡焊料重熔后粘接层孔隙的变化，试验表明金锡共晶烧结时控制好烧结工艺参数，可以保证多次重熔对粘接层孔隙率的影响，粘接质量能满足相关要求。
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| 关 键 词： | 金锡共晶 芯片烧结 空隙率 密封 可靠性 |
Research on Au/Sn Eutectic Sintering Technology of Die Attachment and Remelting Air-tightness |
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| GE Qiu-ling,DING Rong-zheng,MING Xue-fei. Research on Au/Sn Eutectic Sintering Technology of Die Attachment and Remelting Air-tightness[J]. Electronics & Packaging, 2011, 11(12): 4-7 |
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| Authors: | GE Qiu-ling DING Rong-zheng MING Xue-fei |
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| Affiliation: | ( Wuxi Zhongwei High-tech Electronics Co.,Ltd., Wuxi 214035,China ) |
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| Abstract: | In this paper, Au/Sn eutectic sintering technology on the power device packaging application was discussed. The influence of temperature, time and force on Au/Sn sintering were tested in die attach experiments. After Au/Sn sintering to die, Au/Sn sintering to sealing has also been analyzed in the packaging. The result suggests that controlling the sintering parameters will improve the quality of the adhesive layer air- tightness after re-melting. Air tightness and yield rate ofAu/Sn eutectic could be controlled and the packaging reliability will satisfy the need of packaging technology. |
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| Keywords: | Au-Sn eutectic solder die sintering air-tightness hermetic reliability |
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