| SOT82功率产品的热阻控制 |
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| 引用本文： | 鄢胜虎.SOT82功率产品的热阻控制[J].电子与封装,2011,11(10):15-17. |
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| 作者姓名： | 鄢胜虎 |
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| 作者单位： | 汕头华汕电子器件有限公司,广东汕头,515041 |
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| 摘 要： | 文章首先列出了封装过程中可能对SOT82功率产品热阻产生影响的所有因素，并对其中几个关键因素进行了原因分析，如空洞、锡层厚度、锡层倾斜度等。其后，针对这几个关键因素，分别进行对应的装配过程优化改善，来保证SOT82功率产品的热阻稳定。
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| 关 键 词： | SOT82功率产品 热阻 焊料厚度控制 ESEC2005 |
DVT Control for SOT82 Package |
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| YAN Sheng-hu.DVT Control for SOT82 Package[J].Electronics & Packaging,2011,11(10):15-17. |
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| Authors: | YAN Sheng-hu |
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| Affiliation: | YAN Sheng-hu ( Shantou Huashan Electronic Devices CO., LTD, Shantou 515041, China) |
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| Abstract: | First, in this paper we lists major factors which lead to DVT high for SOT82 power device in the assembly process, find out the root causes for some key factors, such as void, solder thickness and die tilt etc. Then ,we have taken some effective improvements for these causes which could reduce the DVT high failure yield. |
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| Keywords: | SOT82 power device DVT high solder thickness control ESEC2005 |
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