| 新型塑封器件开封方法以及封装缺陷 |
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| 引用本文： | 张素娟,李海岸. 新型塑封器件开封方法以及封装缺陷[J]. 半导体技术, 2006, 31(7): 509-511,519 |
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| 作者姓名： | 张素娟 李海岸 |
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| 作者单位： | 北京航空航天大学,总装北航DPA实验室,北京,100083;北京航空航天大学,总装北航DPA实验室,北京,100083 |
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| 摘 要： | 随着塑封器件(PEMs)质量和可靠性的不断提高,塑封器件的应用领域进一步扩展,也逐步应用于军事领域.去除塑料包封层,露出芯片表面,是DPA(破坏性物理分析)及FA(失效分析)的关键一步.对塑封器件的开封技术进行了简要的介绍,并对开封中发现的一些失效模式进行分析.通过对塑封器件开封方法的研究,确保塑封器件的开封质量,为进一步对塑封器件进行DPA和失效分析建立了基础.
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| 关 键 词： | 塑封器件 开封 失效模式 |
| 文章编号： | 1003-353X（2006）07-0509-03 |
| 收稿时间： | 2005-12-01 |
| 修稿时间： | 2005-12-01 |
New Decap Technology for Plastic Encapsulated Microcircuits and Package Failures |
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| ZHANG Su-juan,LI Hai-an. New Decap Technology for Plastic Encapsulated Microcircuits and Package Failures[J]. Semiconductor Technology, 2006, 31(7): 509-511,519 |
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| Authors: | ZHANG Su-juan LI Hai-an |
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| Affiliation: | Beihang University PLA General Armament Department, Beijing 100083, China |
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| Abstract: | With the persistent improvements in quality and reliability, the application of plastic encapsulated microcircuits (PEM) became more widespread, even including the military field. It is a crucial step for destructive physical analysis (DPA) and failure analysis (FA) to remove the plastic package for the die exposing. The decap technologies for PEMs and analysis to the failure models found in the decapsulation processes were introduced. By the researching of the decap technologies, the quality of decapsulation was assured. The fundament for further DPA and FA was established. |
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| Keywords: | plastic encapsulated microcircuits (PEM) decapsulation failure model |
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