电感耦合等离子体原子发射光谱法测定Sn-Ag-Cu系焊锡中铅和镉

样品用盐酸、过氧化氢溶解，在少量硫酸存在下，以盐酸和氢溴酸挥锡,电感耦合等离子体原子发射光谱法测定铅和镉的含量。优化了仪器的工作参数，对溶样酸和锡基体等影响因素进行了试验。本法测铅和镉的线性范围分别为0.50～5.00 μg/mL和0.050～0.50 μg/mL ,检出限分别为13.2 μg/L和0.9 μg/L,样品测定结果的相对标准偏差(n=6)均小于4 %，用标准加入法测得回收率分别为97 %～108 %和90 %～96 %。

Inductively coupled plasma atomic emission spectrometry determination of lead and cadmium in Sn-Ag-Cu system solders

The solder samples were dissolved in hydrochloric acid and hydrogen peroxide. Then, the tin was removed by hydrochloric acid-hydrobromide in presence of little sulfuric acid, and the contents of lead and cadmium were determined by inductively coupled plasma atomic emission spectrometry (ICP-AES). The working parameters of ICP instrument were optimized.The influencing factors such as acid for dissolving sample and tin matrix were tested. The linear ranges in this method were obtained between 0.50- 5.00 μg/mL (for Pb) and 0.050-0.50 μg/mL (for Cd). The detection limits were 13.2 μg/L for Pb and 0.9 μg/L for Cd, respectively. The relative standard deviations (RSD, n=6) were less than 4 %. The recoveries rate for lead and cadmium obtained by standard addition method were 97 % -108 % and 90 %-96 % respectively.