| 功率型LED封装用有机硅材料的研究进展 |
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| 引用本文： | 张宇,王炎伟,张利萍,林祥坚.功率型LED封装用有机硅材料的研究进展[J].有机硅材料,2011,25(3):199-203. |
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| 作者姓名： | 张宇 王炎伟 张利萍 林祥坚 |
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| 作者单位： | 广州天赐有机硅科技有限公司,广州,510760 |
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| 摘 要： | 介绍了发光二极管(LED)的特点、封装形式的发展及对封装材料的性能要求,指出了现有LED封装材料环氧树脂的缺陷,分析了有机硅封装材料的特点,综述了功率型LED封装用有机硅材料的研究进展。
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| 关 键 词： | LED 封装材料 封装形式 硅树脂 硅橡胶 苯基 |
Current Situation of Silicone Materials for High-Power LED Encapsulation |
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| ZHANG Yu,WANG Yan-wei,ZHANG Li-ping,LIN Xiang-jian.Current Situation of Silicone Materials for High-Power LED Encapsulation[J].Silicone Material,2011,25(3):199-203. |
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| Authors: | ZHANG Yu WANG Yan-wei ZHANG Li-ping LIN Xiang-jian |
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| Affiliation: | ZHANG Yu,WANG Yan-wei,ZHANG Li-ping,LIN Xiang-jian(Guangzhou Tinci Silicon Technology Co.,Ltd.,Guangzhou,510760,Guangdong) |
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| Abstract: | The characteristics of the light emitting diode(LED),the development of the encapsulation technology and the requirements for the encapsulation materials were introduced.The disadvantages of epoxy resin used in LED encapsulation were pointed out.The characteristics of the silicone encapsulation materials were analyzed,then the latest research development of silicone materials used for high-power LED encapsulation were reviewed in details. |
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| Keywords: | LED encapsulation material encapsulation technology silicone resin silicone rubber phenyl |
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