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| 采用SU—8胶制作模具的工艺研究 | |
| 引用本文： | 吴元庆,鲁继,刘春梅. 采用SU—8胶制作模具的工艺研究[J]. 传感器与微系统, 2013, 32(4): 51-53 |
| 作者姓名： | 吴元庆 鲁继 刘春梅 |
| 作者单位： | 1. 天津大学电子信息工程学院,天津,300072 2. 核工业理化工程研究院,天津,300180 3. 津伦(天津)精密机械股份有限公司,天津,300384 |
| 摘 要： | 主要描述了SU—8胶制造微流体芯片用模具的工艺研究。讨论了各工艺流程主要包括有前烘、中烘、光刻、显影等因素对模具的影响。提出了一个可供参考的模具制作工艺流程,对抗粘层工艺进行了讨论。另外,在模具制造过程中加入反应离子刻蚀(RIE)来提高SU—8与硅基底的粘附性。最终通过上述的工艺研究,成功制作出了应用于流体的模具,并制造成了微流控芯片。 |
| 关 键 词： | SU—8胶 模具 工艺 |
Research on technology of mold fabrication by SU-8 photoresist |
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| WU Yuan-qing , LU Ji , LIU Chun-mei. Research on technology of mold fabrication by SU-8 photoresist[J]. Transducer and Microsystem Technology, 2013, 32(4): 51-53 | |
| Authors: | WU Yuan-qing LU Ji LIU Chun-mei |
| Affiliation: | 1.School of Electronic and Information Engineering,Tianjin University,Tianjin 300072,China; 2.Research Institute of Physical and Chemical Engineering of Nuclear Industry,Tianjin 300180,China; 3.Keenland(Tianjin)Precision Manufacturing Co Ltd,Tianjin 300384,China) |
| Abstract: | The technology research of mold for microfluidic chips by SU-8 photoresist is described.Effects of factors of processes including prebake,bake,photo lithography,develop and so on,on mold are discussed.A reference for mold making process is proposed,and anti-adhesive layer process is discussed too.Further,reactive ion etching(RIE)is used to improve the adhesion between SU-8 and the silicon substrate.Finally,through above technology studies,mold used in fluid and microfluid chip are produced successfully. |
| Keywords: | SU—8 photoresist mold technology |
| 本文献已被 CNKI 万方数据 等数据库收录！ | |