| 外来物导致的塑封器件金属化层损伤机理分析 |
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| 引用本文： | 梁栋程,刘云婷,何志刚,王晓敏,王聪,唐昶宇,任时成.外来物导致的塑封器件金属化层损伤机理分析[J].微电子学,2017,47(5):729-732. |
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| 作者姓名： | 梁栋程 刘云婷 何志刚 王晓敏 王聪 唐昶宇 任时成 |
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| 作者单位： | 中国工程物理研究院 计量测试中心, 四川 绵阳 621900,中国工程物理研究院 计量测试中心, 四川 绵阳 621900,中国工程物理研究院 计量测试中心, 四川 绵阳 621900,中国工程物理研究院 计量测试中心, 四川 绵阳 621900,中国工程物理研究院 成都科学技术发展中心 成都绿色能源与绿色制造技术研发中心, 成都 610200,中国工程物理研究院 成都科学技术发展中心 成都绿色能源与绿色制造技术研发中心, 成都 610200,中国工程物理研究院 计量测试中心, 四川 绵阳 621900 |
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| 摘 要： | 对塑封器件进行破坏性物理分析(DPA),发现有样品芯片表面存在金属化层损伤。对损伤部位进行背散射电子成像和能谱分析,确定损伤部位存在钢颗粒。结合塑封封装工艺环节进一步分析损伤形貌,结果表明钢颗粒来源于塑封模具破损或老化,在环氧固化过程中产生的应力导致钢颗粒压碎金属化层。分析了具有这类缺陷的塑封器件在高可靠应用领域中的危害性。这类缺陷形成机理不常见,研究结论对改进塑封器件生产工艺具有参考价值。
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| 关 键 词： | 破坏性物理分析 金属层损伤 钢颗粒 环氧固化 塑封模具 |
| 收稿时间： | 2016/12/29 0:00:00 |
Mechanism Analysis for Metallization Damages of Plastic PackagingDevices Caused by Foreign Materials |
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| LIANG Dongcheng,LIU Yunting,HE Zhigang,WANG Xiaomin,WANG Cong,TANG Changyu and REN Shicheng.Mechanism Analysis for Metallization Damages of Plastic PackagingDevices Caused by Foreign Materials[J].Microelectronics,2017,47(5):729-732. |
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| Authors: | LIANG Dongcheng LIU Yunting HE Zhigang WANG Xiaomin WANG Cong TANG Changyu and REN Shicheng |
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| Affiliation: | Metrology and Testing Center of CAEP, Mianyang, Sichuan 621900, P.R.China,Metrology and Testing Center of CAEP, Mianyang, Sichuan 621900, P.R.China,Metrology and Testing Center of CAEP, Mianyang, Sichuan 621900, P.R.China,Metrology and Testing Center of CAEP, Mianyang, Sichuan 621900, P.R.China,Chengdu Green Energy and Green Manufact.Technol.R & D Center, Chengdu Develop.Center of Sci.and Technol., China Academy of Engineer.Physics, Chengdu 610200, P.R.China,Chengdu Green Energy and Green Manufact.Technol.R & D Center, Chengdu Develop.Center of Sci.and Technol., China Academy of Engineer.Physics, Chengdu 610200, P.R.China and Metrology and Testing Center of CAEP, Mianyang, Sichuan 621900, P.R.China |
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| Abstract: | The destructive physics analysis (DPA) was performed on a batch of plastic packaging devices. Some damaged metal layers were found on the surfaces of chip samples. Backscatter electron imaging and energy disperse spectroscopy results showed that there were some steel particles at the damaged region. By identifying the morphology of the damaged region combined with the procedures of plastic packaging, it was found that the steel particles came from the aged or damaged packaging steel mould. As a result, the generated steel particles hurt the metal layer by the stress from epoxy curing during plastic packaging process. The potential harms of these defects in the devices for high reliability fields were analyzed. The forming mechanism of such damages was rarely reported. It was obvious that the new results were significant for improving the production process of plastic packaging devices. |
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| Keywords: | DPA Damage of metal layer Steel particle Epoxy curing Plastic packaging mould |
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