| 铜系电磁屏蔽涂料的研究 |
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| 引用本文： | 何益艳,杜仕国,施冬梅. 铜系电磁屏蔽涂料的研究[J]. 现代涂料与涂装, 2002, 0(5): 1-3,6 |
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| 作者姓名： | 何益艳 杜仕国 施冬梅 |
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| 作者单位： | 军械工程学院三系,石家庄,050003 |
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| 摘 要： | 阐述了电磁屏蔽涂料的电磁屏蔽原理和导电机理;讨论了导电填料的填充量、形状、粒度和填充型导电涂料导电性能的关系;分析了偶联剂、镀覆金属、漆膜厚度及固化条件对导电涂料的导电性能的影响;提出了铜系导电涂料尚需解决的主要问题。
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| 关 键 词： | 电磁屏蔽 导电涂料 铜系导电涂料 |
| 修稿时间： | 2001-12-20 |
STUDY ON COPPER-FILLED ELECTROMAGNETIC SHIELDING PAINT |
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| He Yiyan,Du Shiguo,Shi Dongmei. STUDY ON COPPER-FILLED ELECTROMAGNETIC SHIELDING PAINT[J]. Modern Paint and Finishing, 2002, 0(5): 1-3,6 |
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| Authors: | He Yiyan Du Shiguo Shi Dongmei |
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| Abstract: | The principle of electromagnetic shielding and conductive mechanism of electromagnetic shielding paint are described. Relationship between the nature of conductive filler (charging quantity, shapes and particle size) and the conductive performance of filled conductive paint is discussed. Influence of coupling agent, coating metal, film thickness, and curing schedule on the performance of electromagnetic shielding paint is analyzed. Some main problems to be solved for copper-filled conductive paint are indicated. |
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| Keywords: | electromagnetic shielding conductive paint copper-filled conductive paint |
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