Application of X- ray diffraction to study the grinding induced surface damage mechanism of WC/Co |
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| Affiliation: | 1. Centre for Precision Engineering, School of Mechatronics Engineering, Harbin Institute of Technology, Harbin 150001, China;2. State Key Laboratory of Ultra-precision Machining Technology, The Hong Kong Polytechnic University, Hong Kong;1. Materials Center Leoben Forschung GmbH, Roseggerstraße 12, 8700 Leoben, Austria;2. Montanuniversität Leoben, Institut für Struktur- und Funktionskeramik (ISFK), Peter-Tunner Straße 5, 8700 Leoben, Austria;3. Ceratizit Austria GmbH, Metallwerk-Plansee-Straße 71, 6600 Reutte, Austria |
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| Abstract: | X-ray diffraction was utilized to examine the WC/Co surface after high spindle speed grinding (HSSG) to get a further insight into the machining induced surface damage mechanism. The results showed that grinding induced reorientation and preferred {100}/{10 ?10} growth of WC particles occurred in the deformed surface, while the crystallinity of WC(001) increased. Based on the analysis of the penetration depth of X ray in WC and Co, grazing incidence X-ray diffraction (GIXRD) showed that the grinding induced preferred crystal growth occurred only in the outmost layer (~ 3.324 nm), but the compressive stress was caused to a certain depth of the subsurface (> 756.18 nm). |
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