环氧树脂非等温固化动力学及其固化工艺的研究

采用差示扫描量热法（DSC）研究了N-乙基邻对甲苯磺酰胺/环氧树脂体系的固化过程,研究了不同配比对固化反应的影晌,固化度与固化温度的关系,计算了固化反应表观活化能和反应级数,确定了N-乙基邻对甲苯磺酰胺/环氧树脂体系的固化工艺。结果表明：不同升温速率下,体系固化温度有很大差异,随着升温速率的提高,固化温度增加。通过动力学计算得到体系最佳固化温度为90℃,固化时间为4~6 h,固化体系的活化能为29.1 kJ/mol,反应级数为0.81。

Curing Kinetics of Epoxy Investigated by Non-isothermal Differential Scanning Calorimetry

The curing process of N-ethyl-o-toluene sulfonamide/epoxy resin was studied by the test of differential scanning calorimetry(DSC).The effect of different proportion of N-ethyl-o-toluene sulfonamide and epoxy resin on the curing reaction and the relationship between curing temperature and curing degree were investigated.At last,the apparent activation energy and reaction order were calculated and the curing process of N-ethyl-o-toluene of N-ethyl-o-toluene sulfonamide/epoxy resin was calculated to be 90 ℃ by dynamics,and the curing time was 4~6 h and the activation energy of the curing system was 29.1 kJ/mol and the reaction order was 0.81.