| 电子束固化机理 |
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| 引用本文： | 居学成,哈鸿飞.电子束固化机理[J].涂料工业,1999,29(1):35-36,41. |
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| 作者姓名： | 居学成 哈鸿飞 |
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| 作者单位： | 北京大学技术物理系 |
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| 摘 要： | 主要从下述几方面介绍了电子束固化机理：电子束和紫外光固经机理比较；电子束与介质相互作用过程；电子束固化过程中起作用的活性粒子；电子束固化丙烯酸酯体系和阳离子体系的机理等。
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| 关 键 词： | 电子束固化 紫外光固化 固化 涂料 |
MECHANISM OF ELECTRON BEAM CURING PROCESS |
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| JU Xuecheng,HA Hongfei.MECHANISM OF ELECTRON BEAM CURING PROCESS[J].Paint & Coatings Industry,1999,29(1):35-36,41. |
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| Authors: | JU Xuecheng HA Hongfei |
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| Abstract: | This article has introduced the mechanism of electron beam curing process in the following headings:comparison of EB curing with UV curing process;interaction between EB and media;active particles playing an important role in EB curing process;mechanism of EB curing acrylate system and cationic system.etc. |
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| Keywords: | electron beam curing UV curing active particle acrylate cation |
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