| CL-20与树形分子键合剂的粘附性能研究 |
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| 引用本文： | 潘碧峰,罗运军,谭惠民.CL-20与树形分子键合剂的粘附性能研究[J].含能材料,2004,12(4):199-202. |
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| 作者姓名： | 潘碧峰 罗运军 谭惠民 |
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| 作者单位： | 北京理工大学材料科学与工程学院,北京,100081;北京理工大学材料科学与工程学院,北京,100081;北京理工大学材料科学与工程学院,北京,100081 |
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| 摘 要： | 通过使用扫描电镜(SEM)，X射线光电子能谱(XPS)技术来研究树形分子键合剂(DBA)对CL-20晶体的粘附性能及其界面相互作用机理。实验表明了树形分子键合剂可以在CL-20表面形成-层吸附层，具有良好的粘附性能，X射线光电子能谱的化学位移也表明了键合剂与CL-20的N元素发生诱导效应。
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| 关 键 词： | 材料学 树形分子键合剂(DBA) CL-20 粘附性能 |
| 文章编号： | 1006-9941(2004)04-0199-04 |
| 收稿时间： | 2003/9/23 0:00:00 |
| 修稿时间： | 2003年9月23日 |
Study on Interaction between CL-20 and Dendritic Bonding Agent |
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| PAN Bi-feng,LUO Yun-jun and TAN Hui-min.Study on Interaction between CL-20 and Dendritic Bonding Agent[J].Chinese Journal of Energetic Materials,2004,12(4):199-202. |
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| Authors: | PAN Bi-feng LUO Yun-jun and TAN Hui-min |
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| Affiliation: | Department of Material Science and Technology, Beijing Institute of Technology, Beijing 100081, China;Department of Material Science and Technology, Beijing Institute of Technology, Beijing 100081, China;Department of Material Science and Technology, Beijing Institute of Technology, Beijing 100081, China |
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| Abstract: | A dendritic bonding agent (DBA) that can adhere to CL-20 effectly is reported. The adhesive properties are characterized by scanning electronic microscope (SEM) and X-ray photoelectron spectroscopy (XPS). DBA forms a layer of viscous film on the surface of CL-20; the adhesive degree measured by XPS analysis can be up to 22.87%, the adhesive degree increases by increasing of COOCH_3 group content due to the inducing interaction between N and O. |
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| Keywords: | material science dendritic bonding agent (DBA) CL-20 adhesive property |
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