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| 大功率LED器件封装材料的研究现状 | |
| 引用本文： | 吴启保,青双桂,熊陶,王芳,吕维忠,罗仲宽.大功率LED器件封装材料的研究现状[J].化工技术与开发,2009,38(2). |
| 作者姓名： | 吴启保 青双桂 熊陶 王芳 吕维忠 罗仲宽 |
| 作者单位： | 1. 深圳市方大国科光电技术有限公司,广东,深圳,518055 2. 深圳大学化学与化工学院,广东,深圳,518060 3. 深圳市帝源电子有限公司,广东,深圳,518106 |
| 基金项目： | 深圳市科技计划深港创新圈项目 |
| 摘 要： | LED灯具有高效节能、绿色环保等优点,在照明市场的前景备受各国瞩目,对LED封装材料的研究也备受关注.本文介绍环氧树脂及有机硅的LED封装材料的研究现状以及存在的问题.有机硅封装材料被认为是大功率LED器件封装的最佳材料.高性能有机硅封装材料将具有广阔的应用前景及巨大的经济效益. |
| 关 键 词： | 封装材料 环氧树脂 有机硅 |
Current Situation of High-Power LED Encapsulant |
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| WU Qi-bao,QING Shuang-gui,XIONG Tao,WANG Fang,LV Wei-zhong,LUO Zhong-kuan.Current Situation of High-Power LED Encapsulant[J].Technology & Development of Chemical Industry,2009,38(2). | |
| Authors: | WU Qi-bao QING Shuang-gui XIONG Tao WANG Fang LV Wei-zhong LUO Zhong-kuan |
| Affiliation: | 1.Shenzhen Fangda Guoke Optronics Technical CO.LTD.;Shenzhen 518055;China;2.College of Chemistry and Chemical Engineering;Shenzhen University;Shenzhen 518060;3.Shenzhen Diyuan Electronic CO.LTD.;Shenzhen 518106;China |
| Abstract: | LED had been attracted much attention in the field of semiconductor,because of its energy conservation and environment-friendly.The current situation and existing problems of LED encapsulant,included epoxy resin and organic silicon,were introduced.Organic silicon was considered to be the best material for encapsulant of high-power LED.There were good prospect of applocations and great economic for the good performance organic silicon encapsulant. |
| Keywords: | LED |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |