Passive alignment optical subassemblies for military/aerospacefiber-optic transmitter/receiver modules |
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| Authors: | Beranek M.W. Chan E.Y. Chiu-Chao Chen Davido K.W. Hager H.E. Chi-Shain Hong Koshinz D.G. Rassaian M. Soares H.P. Jr. St. Pierre R.L. Anthony P.j. Cappuzzo M.A. Gates J.V. Gomez L.T. Henein G.E. Shmulovich J. Occhionero M.A. Fennessy K.P. |
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| Affiliation: | Boeing Aerosp., Seattle, WA; |
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| Abstract: | Under the DARPA sponsored Avionics Optoelectronic Module Technology program, new passive alignment carrier (PAC) optical subassemblies (LED-PAC and PIN-PAC) ruggedized for military/aerospace avionics fiber-optic transmitter and receiver applications have been developed, LED-PAC and PIN-PAC silicon micro-optical bench substrates were fabricated together on a 5 in diameter silicon wafer via multistage photolithography, thin-film, and substrate processing. Alignment v-grooves designed for passive optical alignment of 100/140 μm multimode optical fiber to the optoelectronic devices were terminated by solder locking the fiber to the silicon PAC substrates. The LED-PAC comprising a surface emitting LED die-bonded onto a novel precision molded AM submount passively mounted onto the silicon microbench achieves the required high coupling efficiency to 100/140 μm multimode optical fiber to meet stringent avionics transmitter output power requirements. The 100/130 μm multimode optical fiber-pigtailed PIN-PAC with a refractive lens etched into the p-i-n photodiode backside surface exhibited responsivities greater than 0.8 A/W at 1.3 μm wavelength. The LED-PAC and PIN-PAC optical subassemblies integrated with Boeing ARINC 636 (FDDI) transmitter and receiver thick film multichip (MCM-C) circuitry are capable of meeting both ARINC 636 and FDDI physical layer requirements |
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