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IC failure analysis: magic, mystery, and science
Authors:Soden  JM Anderson  RE Henderson  CL
Affiliation:Sandia Nat. Labs., Albuquerque, NM;
Abstract:Advancing IC and packaging technologies motivate and direct the future of failure analysis. The authors review current tools and techniques and discuss challenges and opportunities created by the industry's critical need for new diagnosis and failure analysis paradigms
Keywords:
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