晶圆制备工艺用清洗洁净及环保新技术

在简要介绍传统的湿法清洗与干法清洗技术的基础上,分析了几种晶圆制备工艺中的清洗洁净与环保新技术,包括HF与臭氧槽式清洗法、HF与臭氧单片清洗法以及无损伤和抑制腐蚀损伤的清洗方法等.分析结果表明,采用新技术清洗后的晶片表面可以满足更小线宽器件的要求,由于清洗工艺和步骤得到简化,所以使清洗设备小型化成为可能,同时新技术不仅节省了洁净间面积,而且有效地降低了环境污染.

Novel Environment Protection and Clean Technologies for Wafer

Based on the brief introduction of conventional technologies of wet and dry cleaning, several novel technologies of cleaning and environment protection for wafer preparation were discussed, including HF/O3 wet sink cleaning, HF/O3 single-wafer spin cleaning, non-damage and erode-restrained cleaning methods and so on. The analysis results show the wafer surface cleaned with new technologies can meet the demands of components of smaller linewidth. The clean processes are simplified and the area of clean room is reduced, which makes the miniaturization of clean equipment possible and the environment pollution is also retrenched.