| PCB表面涂覆用的浸镀银现状 |
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| 引用本文： | 蔡积庆.PCB表面涂覆用的浸镀银现状[J].印制电路信息,2009(3):35-40. |
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| 作者姓名： | 蔡积庆 |
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| 作者单位： | 江苏,南京,210018
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| 摘 要： | 概述了浸镀银作为PCB的最终表面精饰的现状和浸银的诸特性（焊接性、线粘结性、迁移性、电池腐蚀、蠕变腐蚀）。
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| 关 键 词： | 浸镀银 最终表面精饰 印制板 |
Present Situation of Immersion Silver Plating for PCB Surface Finishing |
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| CAI Ji-qing.Present Situation of Immersion Silver Plating for PCB Surface Finishing[J].Printed Circuit Information,2009(3):35-40. |
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| Authors: | CAI Ji-qing |
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| Affiliation: | CAI Ji-qing |
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| Abstract: | This paper describes the present situasion of immersion silver plating as final surface finishing for PCB, and characteristic of immersion silver （solderability,wire bonding,migration,galvnic attack and creeping corrosion）. |
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| Keywords: | immersion silver plating final surface finishing PCB |
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