| 面向超高温压力传感器的SiC-SiC键合方法 |
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| 引用本文： | 张德远,赵一举,蒋永刚. 面向超高温压力传感器的SiC-SiC键合方法[J]. 纳米技术与精密工程, 2014, 0(4): 258-262 |
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| 作者姓名： | 张德远 赵一举 蒋永刚 |
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| 作者单位： | 北京航空航天大学机械工程及自动化学院,北京100191 |
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| 基金项目： | 国家自然科学基金资助项目（51205012）. |
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| 摘 要： | 为了实现耐高温压力传感器SiC腔体的制作,分别利用高性能陶瓷胶、旋涂玻璃和金属Ni等3种材料作为键合层,研究了SiC-SiC键合工艺.扫描电子显微镜和键合拉伸强度实验结果表明,这3种材料的键合层均可以成功应用于SiC-SiC键合,其中高性能陶瓷胶键合层厚度为20~30μm,键合强度可达4 MPa;旋涂玻璃键合层厚度为2μm左右,键合强度约1.5 MPa;金属Ni键合层厚度为1μm,键合强度约为0.5 MPa.
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| 关 键 词： | 碳化硅键合 陶瓷胶 键合强度 压力传感器 |
SiC-SiC Bonding Methods for Ultra High-Temperature Pressure Sensors |
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| Zhang Deyuan,Zhao Yiju,Jiang Yonggang. SiC-SiC Bonding Methods for Ultra High-Temperature Pressure Sensors[J]. Nanotechnology and Precision Engineering, 2014, 0(4): 258-262 |
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| Authors: | Zhang Deyuan Zhao Yiju Jiang Yonggang |
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| Affiliation: | School of Mechanical Engineering and Automation, Beihang University, Beijing 100191, |
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| Abstract: | To produce the high-temperature pressure sensor cavity by SiC, this paper describes a SiC-SiCbonding process using high-performance ceramic adhesive, spin-on glass and Ni, respectively. Test results show that the three materials can all be used in SiC-SiC bonding by scanning electron microscopeand tensile test for bonding strength. The thickness of the high-performance ceramic adhesive layer fallsin the range of 20--30 μm, and its maximum bonding strength is approximately 4 MPa. The thickness ofthe spin-on glass layer is approximately 2 μm, and its maximum bonding strength is characterized as 1.5MPa. The thickness of the Ni layer is approximately 1 μm, and its maximum bonding strength is 0. 5MPa. The three types of bonding processes show potential application in SiC based high-temperature pres-sure sensor. |
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| Keywords: | SiC bonding ceramic adhesive bonding strength pressure sensor |
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