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InGaN与采用InGaN作为背势垒的双异质结的生长
引用本文:史林玉,张进城,王昊,薛军帅,欧新秀,付小凡,陈珂,郝跃. InGaN与采用InGaN作为背势垒的双异质结的生长[J]. 半导体学报, 2010, 31(12): 123001-4
作者姓名:史林玉  张进城  王昊  薛军帅  欧新秀  付小凡  陈珂  郝跃
摘    要:我们研究了采用MOCVD生长了InGaN与InGaN和AlGaN/GaN/InGaN/GaN双异质结。我们发现InGaN的质量会严重影响AlGaN/GaN/InGaN/GaN双异质结的特性。通过优化生长压力与生长温度得到高结晶质量的InGaN薄膜。由于InGaN的极化方向与AlGaN的相反,使得GaN层与InGaN层之间出现了一个高势垒,提高了载流子的限域性并且降低了缓冲层的漏电。采用InGaN作为背势垒的双异质结的DIBL仅为1.5 mV/V。当VDS= 10 V时,测量得到的关态漏电流为2.6 µA/mm。

关 键 词:双异质结构  氮化铟镓  InGaN  高电子迁移率晶体管  化学气相沉积法  生长  晶体质量  泄漏电流
收稿时间:2010-05-06
修稿时间:2010-07-19

Growth of InGaN and double heterojunction structure with InGaN back barrier
Shi Linyu,Zhang Jincheng,Wang Hao,Xue Junshuai,Ou Xinxiu,Fu Xiaofan,Chen Ke and Hao Yue. Growth of InGaN and double heterojunction structure with InGaN back barrier[J]. Chinese Journal of Semiconductors, 2010, 31(12): 123001-4
Authors:Shi Linyu  Zhang Jincheng  Wang Hao  Xue Junshuai  Ou Xinxiu  Fu Xiaofan  Chen Ke  Hao Yue
Affiliation:Key Laboratory of Wide Band Gap Semiconductor Materials and Devices, Institutes of Microelectronics, Xidian University, Xi'an 710071, China;Key Laboratory of Wide Band Gap Semiconductor Materials and Devices, Institutes of Microelectronics, Xidian University, Xi'an 710071, China;Key Laboratory of Wide Band Gap Semiconductor Materials and Devices, Institutes of Microelectronics, Xidian University, Xi'an 710071, China;Key Laboratory of Wide Band Gap Semiconductor Materials and Devices, Institutes of Microelectronics, Xidian University, Xi'an 710071, China;Key Laboratory of Wide Band Gap Semiconductor Materials and Devices, Institutes of Microelectronics, Xidian University, Xi'an 710071, China;Key Laboratory of Wide Band Gap Semiconductor Materials and Devices, Institutes of Microelectronics, Xidian University, Xi'an 710071, China;Key Laboratory of Wide Band Gap Semiconductor Materials and Devices, Institutes of Microelectronics, Xidian University, Xi'an 710071, China;Key Laboratory of Wide Band Gap Semiconductor Materials and Devices, Institutes of Microelectronics, Xidian University, Xi'an 710071, China
Abstract:
Keywords:InGaN back barrier  double hererojunction  carrier confinement
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