|
|||||
|
|
Experimental verification of pH localization mechanism of particle consolidation at the electrode/solution interface and its application to pulsed DC electrophoretic deposition (EPD) |
|
| Authors: | Laxmidhar Besra Tetsuo Uchikoshi Tohru S. Suzuki Yoshio Sakka |
| Affiliation: | 1. Colloids & Materials Chemistry Department, Institute of Minerals & Materials Technology (IMMT), Bhubaneswar 751 013, Orissa, India;2. Nano Ceramics Center, Fine Particle Processing Group, National Institute for Materials Science (NIMS), 1-2-1 Sengen, Tsukuba, Ibaraki 305-0047, Japan;1. Faculty of Material Science and Ceramics, AGH University of Science and Technology, al. Mickiewicza 30, 30-059 Krakow, Poland;2. Faculty of Chemistry, Jagiellonian University, ul. Ingardena 3, 30-060 Krakow, Poland;1. CEITEC IPM, Institute of Physics of Materials, Academy of Sciences of the Czech Republic, Zizkova 513/22, 616 62 Brno, Czech Republic;2. CEITEC BUT, Brno University of Technology, Technicka 10, 616 00 Brno, Czech Republic;1. State Key Laboratory of Material Processing and Die & Mould Technology, School of Material Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China;2. Research Institute of Huazhong University of Science and Technology in Shenzhen, Shenzhen 518057, China;3. State Key Lab of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China |
| Abstract: | Experimental measurement and verification of the pH localization at the electrode/solution interface was conducted during continuous and pulsed DC electrophoretic deposition (EPD) from aqueous solution. Application of pulsed DC enabled controlling bubble incorporation and obtaining bubble-free deposits during electrophoretic deposition (EPD) from aqueous suspension. The pH localization at the electrode/solution interface on application of electric field was attributed as the underlying mechanism of particle consolidation during continuous as well as pulsed EPD. The suspension pH tends to shift towards isoelectric point (i.e.p.) leading to spontaneous coagulation of particles at the electrode. Application of continuous DC tends to attain the i.e.p. faster and closer compared to pulse DC leading to maximum deposit yield. The kinetics and closeness of attainment of pH towards i.e.p. decreased progressively with decreasing pulse size resulting in a corresponding decrease in deposit yield. |
| Keywords: | |
| 本文献已被 ScienceDirect 等数据库收录！ | |