扇出型晶圆级封装中圆片翘曲研究

在扇出型晶圆级封装工艺中,由于芯片材料与塑封料之间的热膨胀系数差异,晶圆塑封过程中必然会形成一定的翘曲.如何准确预测晶圆的翘曲并对翘曲进行控制是扇出型晶圆级封装技术面临的挑战之一.在讨论圆片翘曲问题时引入双层圆形板弯曲理论与复合材料等效方法,提出一套扇出型晶圆级封装圆片翘曲理论模型,并通过有限元仿真与试验测试验证了该翘...

Research of Wafer Warpage in Wafer-Level Fan-Out Packaging

In wafer level fan out process,due to the CTE mismatch between chip and EMC,certain warpage will be formed after molding.How to accurately predict and control wafer warpage is one of the challenges for wafer-level fan-out packaging technology.In this study,the bending theory of Bi-material circular plate model and the equivalent method of composite materials are introduced to discuss the warpage problem of wafer,and a theoretical model of wafer-level fan-out packaging is proposed.The accuracy of the theoretical model is verified by finite element simulation and test.The application of the theoretical model in practical engineering is given,which is of great significance to wafer-level fan-out packaging products.