玻璃通孔技术研究进展

近年来,随着5G、可穿戴设备、智能手机、汽车电子、人工智能等新兴领域蓬勃兴起,集成电路应用正向着多元化应用方向发展,先进三维封装技术也逐渐成为实现电子产品小型化、轻质化、多功能化的重要手段。玻璃通孔(TGV)互连技术具有高频电学特性优异、成本低、工艺流程简单、机械稳定性强等应用优势,在射频器件、微机电系统(MEMS)封装、光电系统集成等领域具有广泛的应用前景。综述了国内外高密度玻璃通孔制作、金属填充、表面高密度布线的研究进展,对玻璃通孔技术特点及其应用进行了总结。

Development of Through Glass Via Technology

In recent years,with the booming of 5G,wearable devices,smart phones,automotive electronics,artificial intelligence and other emerging fields,integrated circuit applications are developing towards the direction of diversification,and advanced three-dimension packaging technology has gradually become an important means to achieve miniaturization,lightness and multi-function of electronic products.Through glass via(TGV)technology has the advantages of excellent high-frequency electrical characteristics,low cost,simple process flow,strong mechanical stability and so on,so it has a broad application prospect in RF devices,MEMS packaging,photoelectric system integration and other fields.In this paper,the research progress of the formation of high-density TGVs,metal filling of TGVs and high-density redistribution layer(RDL)technology in china and abroad is reviewed,and the characteristics of TGV technology and its application are summarized.