Effects of nitrogen and argon as carrier gases and annealing ambients on the physical properties of PECVD silicon nitride

Deposition of memory quality plasma-enhanced chemically vapor deposited silicon nitride and post-deposition modification by annealing using argon and nitrogen for carrier gases and annealing ambients have been studied. Although similar memory performance can be achieved, the deposition power and NH₃/SiH₄ ratio required to do so are functions of the carrier gas used since nitrogen actively participates in the deposition process. Fourier transform infrared, ultraviolet and Auger data reveal that materials deposited with the two gases have similar physical properties although argon films are less dense and lose hydrogen at a higher rate when subjected to annealing. Post-deposition annealing can be used to enhance memory properties of the material provided that the anneal is accomplished at 475°C for 30 minutes. However, enhancement of memory performance by annealling occurs only if the nitride has been deposited using optimum deposition parameters. When annealing is performed in nitrogen. Auger data suggest that nitrogen can be supplied to, or removed from, the material depending on the anneal temperature.